PROCESSOR TRADE-OFF CRITERIA
- Architecture/Hardware
- Performance: Peak and sustained
- I/O bandwidth: Intra-board, board-to-board, chassis-to-chassis, pin requirements
- Memory (size/performance): Cache, local and global
- Power dissipation: Static and dynamic
- Testability: Fault coverage, BIST support, test time
- Mechanical packaging complexity
- Thermal issues
- Scalability/upgradability
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PROCESSOR TRADE-OFF CRITERIA (continued)
- Software
- Compliers: Availability/efficiency
- Operating system: Functionality, performance, availability, maturity, board support package
- Costs: Non-recurring, production, test, life-cycle
- Risks: Technical, schedule, cost
- Quality: Defect level, reliability
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