Model Year Architecture

TECHNICAL OBJECTIVES
  • Promote Model Year Architecture (MYA) approach to upgradeable architectural ans software components through
    • Specification and Iser Guides
    • Reuse Library Encapsulations
    • Develop advanced encapsulation techniques to promote plug-and-play interoperability

    BENEFITS

    • Reduced cycle time and cost of new and upgraded designs
    • Provides a path to enable design reuse and technology upgrades
DELIVERABLES / DOCUMENTS
  • Standard Virtual Interface (SVI Specification) -- Available
  • Processing Element Specification -- Available
  • Reconfigurable Network Interface (RNI) Spec. -- Available
  • Hardware / Software Architecture Element Spec -- 1Q/97
    • Includes: Guidlines and application notes
  • Reuse Library Specification -- 3Q/97
  • Functional Encapsulation Examples on Web -- 3Q/97
  • Application Note

Next Concept

RELATED EFFORTS (DARPA - ITO)

  • Virtual Microarchitecture Interface Program
    • Provides real-time netowrk-level interoperability for scalable interconnects
    • Provides hardware-centric version of MYA external network interface (Reconfigurable Network Interface) with 100x latency improvement
    • Provides tie-in to DARPA-HPSC Common Logic Frame (CLF)
  • Virtual Socket Interface Alliance (VSIA)
  • MYA is being considered by VSIA system design group as a standard to support reuse

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WBS Element No.: 1.1.1
Point of Contact: Janet Wedgwood (609) 338 - 4197
or e-mail :jwedgwoo@atl.lmco.com

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