Physical Partitioning - Savantage

• Simplify physical implementation tradeoffs:
  • Chip vs. MCM
  • MCM/Board technologies
  • Package alternatives
• Provide links to analysis (cost, thermal, etc.) and downstream tools

BENEFITS

• Perform analysis of physical size, cost, thermal properties earlier and faster than is now possible , i.e., architecture selection/trade-off phase
• More optimal solutions by enabling an efficient exploration of design alternatives

• Funding of first generation MSDA tool from MCC for Design Specification and Integration Plan
  • Design advisor
  • Interference development
  • MSDA integration conversions
  • Mentor Graphics Falcon Framework integration
• Benchmark-3
  • Input Benchmark 3 data for FPCTL
    • Shadowing Benchmark 3 partitioning effort