Model-Year Architecture Demo Example

• Demonstrate upgrade/technology insertion using Standard Virtual Interface encapsulated reuse elements
  • "Upgrade" Benchmark 2 Data I/O Board fabric interface from RACEway to BIN-PCI (WSSPT PCI-like multidrop bus)
  • Benchmark 2 Data I/O board Hot Rod Interface, Mercury RINO RACEway Interface, and BIN-PCI Interface encapsulations developed independently
  • Interchangability of reuse components is demonstrated in VHDL testbench
    
    

. IMPACT

• Defines a structured framework
  • Ensures that designs incorporate all the features necessary to enable low-cost technology upgrades for embedded signal processors
• Supports reuse
  • Significant contribution to 4x improvement in development and life-cycle costs
• Provides open specifications, examples and application notes for designers to follow